[Editors] MIT model could aid design of nanomaterials
Elizabeth Thomson
thomson at MIT.EDU
Thu Mar 1 09:45:30 EST 2007
MIT News Office
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MIT model could aid design of nanomaterials
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For Immediate Release
THURSDAY, MAR. 1, 2007
Contact: Elizabeth A. Thomson, MIT News Office
Phone: 617-258-5402
Email: thomson at mit.edu
IMAGE AVAILABLE
CAMBRIDGE, Mass.--Researchers from MIT, Georgia Institute of
Technology and Ohio State University have developed a new computer
modeling approach to study how materials behave under stress at the
atomic level, offering insights that could help engineers design
materials with an ideal balance between strength and resistance to
failure.
When designing materials, there is often a tradeoff between strength
and ductility (resistance to breaking)-properties that are critically
important to the performance of materials.
Recent advances in nanotechnology have allowed researchers to
manipulate a material's nanostructure to make it both strong and
ductile. Now, the MIT-related team has figured out why some
nano-designed metals behave with that desirable compromise between
strength and ductility.
The team, led by Subra Suresh, the Ford Professor of Engineering in
the Department of Materials Science and Engineering, developed a
simulation method derived from experimental data that allows them to
visualize the deformation of materials on a timescale of minutes.
Previous methods allowed for only a nanosecond-scale glimpse at the
atomic-level processes.
"It's a method to look at mechanical properties at the atomic scale
of real experiments without being bogged down by limitations of
nanosecond timescales of the simulation methods such as molecular
dynamics," said Suresh, the senior author of a paper on the work that
appears as the cover story in the Feb. 27 issue of the Proceedings of
the National Academy of Sciences.
Using the new method, the researchers found that the ductility and
strength of materials are greatly influenced by a special kind of
interface known as the twin boundary-an abrupt internal interface
each side of which is a precise mirror reflection of atoms of the
other side. Twin boundaries can be introduced in various densities,
in a controlled manner, inside a nanocrystalline metal.
For many years, engineers have been able to tinker with the structure
of metals to make them stronger. Most commonly used metals, including
copper, silver, gold and aluminum, are traditionally made from
micrometer-scale "building blocks" called grains, which each contain
many millions of atoms.
About two decades ago, materials engineers discovered that when they
made those grains smaller, typically tens of nanometers in average
size, metals become stronger. Known as nanocrystalline metals, they
are several times stronger than conventional microcrystalline metals.
However, as nanocrystalline metals become stronger, they also become
more brittle (less ductile). For example, copper with a grain size of
10 micrometers may have a ductility of about 50 percent (depending on
exact composition), but at a 10 nanometer grain size, the ductility
is below 5 percent, according to Suresh.
"In most applications, you need optimum combinations of strength and
ductility," Suresh said.
A few years ago, researchers at the Shenyang National Laboratory for
Materials Science in China synthesized a novel form of nanostructured
metal, nano-twinned copper. The material was created by introducing
controlled concentrations of twin boundaries within very small grains
of the metal using a technique known as pulsed electrodeposition.
The Shenyang group, working in collaboration with Suresh's group at
MIT, demonstrated in the last two years that nano-twinned copper has
many of the same desirable characteristics as nano-grained copper,
and in addition resulted in a good combination of strength and
ductility. By controlling the thickness and spacing of twin
boundaries inside small grains to nanometer-level precision, they
were able to produce copper with different "tunable" combinations of
strength and ductility.
Internal interfaces such as grain boundaries (which occur between
grains) and twin boundaries play a critical role in the strength and
ductility of metals.
When there are smaller grains in the metal structure, and hence more
grain boundaries for a given volume, there is more interaction
between the boundaries and dislocations, or string-like defects in
the material that move inside and between grains during mechanical
deformation. The larger proportion of these boundaries contributes to
the brittleness of the metal.
Adding nano-scale twin boundaries, which effectively subdivide the
grains, has a similar strengthening effect, but the twin boundaries
do not promote the same level of brittleness as grain boundaries do.
"You can trick the material and optimize both strength and ductility
by modifying the interactions between dislocations and these
nano-scale twin boundaries inside the grain," said Suresh.
The new study reveals that the ductility of nano-twinned copper can
be attributed to changes in the atomic structure of the twin
boundaries as the material is deformed.
Metals with more twin boundaries also maintain their electrical
conductivity better than metals with more grain boundaries, making
them potentially more useful for applications such as computer chip
components. Nanocrystalline metals that are both strong and ductile
could also be useful for many wear-resistant thin-film coating
applications and MEMS (micro-electro-mechanical systems) devices,
Suresh said.
The researchers plan to use their new approach to look at such things
as the structures of other materials and other types of boundaries.
Suresh's collaborators on the paper include two former MIT graduate
students, Ting Zhu, now an assistant professor at Georgia Tech, and
Ju Li, now an assistant professor at Ohio State. Other authors are
Amit Samanta and Hyoung Gyu Kim, both of Ohio State.
The research was funded by the National Science Foundation, the
Office of Naval Research, the Air Force Office of Scientific
Research, the Department of Energy, the Ohio Supercomputer Center and
the Defense University Research Initiative in NanoTechnology.
--END--
Written by Anne Trafton, MIT News Office
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