[Crib-list] IEEE HPEC Call for Papers Deadline July 9 (fwd)
Shirley Entzminger
daisymae at math.mit.edu
Thu Jun 10 16:01:22 EDT 2021
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CALL FOR PAPERS
PAPER SUBMISSION DEADLINE:
JULY 09, 2021
Visit the HPEC Website<https://r20.rs6.net/tn.jsp?f=001QAem7IqBNmaWiCEYVp9rAeXG1Z8Z4kf7ETIlESQEXJWfVjVvXs4RkW9bKEaslWhM9ZsP1HQu3m0PN7eFLfleslhWMi12C4vCGwqCVYgVGkXDnQp9vy8DURmzAaYqrDqFtKPuHdEkbfU=&c=jc4TYS4RD6zmc9BkcWNeLzZyvsMzp1EREthJVT3H7nYyNyGY0ujIMg==&ch=VHmwitylwgSpnJNrno-cgIVzk1wSsy0hkNfbNNQue6UBxwE4wFFgxw==>
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The IEEE High Performance Extreme Computing Conference (HPEC 21) will be held as a virtual conference on 21 - 23 September 2021.
The HPEC charter is to be the premier conference in the world on the confluence of HPC and Embedded Computing.
The technical committee seeks new presentations that clearly describe advances in high performance extreme computing technologies, emphasizing one or more of the following topics:
* Al / Machine Learning
* Graph Analytics and Network Science
* Advanced Multicore Software Technologies
* Advanced Processor Architectures
* Automated Design Tools
* Big Data and Distributed Computing
* Big Data Meets Big Compute
* Case Studies and Benchmarking of Applications
* Cloud HPEC
* Computing Technologies for Challenging Form Factors
* ASIC and FPGA Advances
* Quantum and Non-Deterministic Conmputing
* Data Intensive Computing
* Digital Front Ends
* Fault-Tolerant Computing
* General Purpose GPU Computing
* High Performance Data Analysis
* Interactive and Real-Time Supercomputing
* Mapping and Scheduling of Parallel and Real-Time Applications
* New Application Frontiers
* Open System Architectures
* Secure Computing & Anti-Tamper Technologies
Important Dates
Submission Deadline: July 09, 2021
Notification of Acceptance: August 13, 2021
Camera Ready Deadline: August 31, 2021
HPEC accepts two types of submissions:
Full papers (up to 6 pages, references not included), and
Extended abstracts (up to 2 pages, references included).
All submissions must be submitted through the Conference Management Toolkit (CMT) at:
https://cmt3.research.microsoft.com/IEEEHPEC2021/<https://r20.rs6.net/tn.jsp?f=001QAem7IqBNmaWiCEYVp9rAeXG1Z8Z4kf7ETIlESQEXJWfVjVvXs4RkUERpbw3tSvFA_IoVBbfinyjhxL2xn1OVfJ48UR3ESlElYVv6ihabK2Z5EhbiX2O7qEqTScqWs5UcMPnjwv6xKGHPyXdHMvdme0sx-Qghi9y02VMezLtK55qseoWkJ3ZgA==&c=jc4TYS4RD6zmc9BkcWNeLzZyvsMzp1EREthJVT3H7nYyNyGY0ujIMg==&ch=VHmwitylwgSpnJNrno-cgIVzk1wSsy0hkNfbNNQue6UBxwE4wFFgxw==>
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Visit the HPEC Website<https://r20.rs6.net/tn.jsp?f=001QAem7IqBNmaWiCEYVp9rAeXG1Z8Z4kf7ETIlESQEXJWfVjVvXs4RkW9bKEaslWhM9ZsP1HQu3m0PN7eFLfleslhWMi12C4vCGwqCVYgVGkXDnQp9vy8DURmzAaYqrDqFtKPuHdEkbfU=&c=jc4TYS4RD6zmc9BkcWNeLzZyvsMzp1EREthJVT3H7nYyNyGY0ujIMg==&ch=VHmwitylwgSpnJNrno-cgIVzk1wSsy0hkNfbNNQue6UBxwE4wFFgxw==>
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